147 lines
7.2 KiB
XML
147 lines
7.2 KiB
XML
<?xml version="1.0" encoding="utf-8"?>
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<!DOCTYPE eagle SYSTEM "eagle.dtd">
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<!--
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INMP441 Breakout Module - Fusion 360 Electronics / Eagle library
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Target: common purple/green INMP441 I2S MEMS microphone breakout
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(the one sold on AliExpress/Amazon with a 1x6 2.54 mm pin header).
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Nominal module size: 15.0 x 10.5 mm, pin header on one long edge.
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Pin order (from the silkscreen of the most common variant):
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1 = SCK (I2S bit clock)
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2 = SD (I2S data out)
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3 = WS (I2S word select / LRCLK)
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4 = L/R (channel select: GND = left, VDD = right)
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5 = GND
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6 = VDD (1.8 - 3.3 V)
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Footprint: 1x6 through-hole header, 2.54 mm pitch, drill 1.0 mm,
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pad 1.8 mm. Module outline drawn on tPlace (layer 21) and tDocu
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(layer 51), with a keepout around the MEMS port hole.
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Author: generated for Ti-pote project, 2026-04-08.
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Verify against your actual module before ordering PCBs.
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-->
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<eagle version="9.6.2">
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<drawing>
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<settings>
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<setting alwaysvectorfont="no"/>
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<setting verticaltext="up"/>
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</settings>
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<grid distance="0.1" unitdist="inch" unit="inch" style="lines" multiple="1" display="no" altdistance="0.01" altunitdist="inch" altunit="inch"/>
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<layers>
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<layer number="1" name="Top" color="4" fill="1" visible="yes" active="yes"/>
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<layer number="16" name="Bottom" color="1" fill="1" visible="yes" active="yes"/>
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<layer number="17" name="Pads" color="2" fill="1" visible="yes" active="yes"/>
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<layer number="18" name="Vias" color="2" fill="1" visible="yes" active="yes"/>
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<layer number="19" name="Unrouted" color="6" fill="1" visible="yes" active="yes"/>
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<layer number="20" name="Dimension" color="15" fill="1" visible="yes" active="yes"/>
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<layer number="21" name="tPlace" color="7" fill="1" visible="yes" active="yes"/>
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<layer number="22" name="bPlace" color="7" fill="1" visible="yes" active="yes"/>
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<layer number="25" name="tNames" color="7" fill="1" visible="yes" active="yes"/>
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<layer number="26" name="bNames" color="7" fill="1" visible="yes" active="yes"/>
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<layer number="27" name="tValues" color="7" fill="1" visible="yes" active="yes"/>
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<layer number="28" name="bValues" color="7" fill="1" visible="yes" active="yes"/>
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<layer number="39" name="tKeepout" color="4" fill="11" visible="yes" active="yes"/>
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<layer number="40" name="bKeepout" color="1" fill="11" visible="yes" active="yes"/>
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<layer number="51" name="tDocu" color="7" fill="1" visible="yes" active="yes"/>
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<layer number="52" name="bDocu" color="7" fill="1" visible="yes" active="yes"/>
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<layer number="94" name="Symbols" color="4" fill="1" visible="yes" active="yes"/>
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<layer number="95" name="Names" color="7" fill="1" visible="yes" active="yes"/>
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<layer number="96" name="Values" color="7" fill="1" visible="yes" active="yes"/>
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<layer number="97" name="Info" color="7" fill="1" visible="yes" active="yes"/>
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<layer number="98" name="Guide" color="6" fill="1" visible="yes" active="yes"/>
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</layers>
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<library>
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<description>INMP441 I2S MEMS microphone breakout module (1x6 2.54 mm header). Generated for Ti-pote project.</description>
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<packages>
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<package name="INMP441_BREAKOUT_1X6">
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<description>INMP441 breakout module, 15.0 x 10.5 mm, 1x6 pin header, 2.54 mm pitch.
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Pins numbered 1..6 = SCK, SD, WS, L/R, GND, VDD.</description>
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<!-- Module outline on silkscreen (tPlace) -->
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<wire x1="-7.5" y1="-5.25" x2="7.5" y2="-5.25" width="0.127" layer="21"/>
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<wire x1="7.5" y1="-5.25" x2="7.5" y2="5.25" width="0.127" layer="21"/>
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<wire x1="7.5" y1="5.25" x2="-7.5" y2="5.25" width="0.127" layer="21"/>
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<wire x1="-7.5" y1="5.25" x2="-7.5" y2="-5.25" width="0.127" layer="21"/>
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<!-- Same outline on tDocu -->
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<wire x1="-7.5" y1="-5.25" x2="7.5" y2="-5.25" width="0.05" layer="51"/>
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<wire x1="7.5" y1="-5.25" x2="7.5" y2="5.25" width="0.05" layer="51"/>
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<wire x1="7.5" y1="5.25" x2="-7.5" y2="5.25" width="0.05" layer="51"/>
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<wire x1="-7.5" y1="5.25" x2="-7.5" y2="-5.25" width="0.05" layer="51"/>
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<!-- Pin 1 marker (small triangle near SCK) -->
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<wire x1="-6.9" y1="-3.1" x2="-6.1" y2="-3.1" width="0.2" layer="21"/>
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<wire x1="-6.5" y1="-3.1" x2="-6.5" y2="-3.7" width="0.2" layer="21"/>
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<!-- MEMS acoustic port keepout (top-port mic, approx 1 mm dia) -->
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<circle x="3.5" y="1.5" radius="0.9" width="0.1" layer="39"/>
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<circle x="3.5" y="1.5" radius="0.9" width="0.05" layer="51"/>
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<!-- Through-hole pads, 2.54 mm pitch, centered, along bottom edge -->
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<pad name="1" x="-6.35" y="-2.54" drill="1.0" diameter="1.8" shape="square"/>
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<pad name="2" x="-3.81" y="-2.54" drill="1.0" diameter="1.8"/>
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<pad name="3" x="-1.27" y="-2.54" drill="1.0" diameter="1.8"/>
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<pad name="4" x="1.27" y="-2.54" drill="1.0" diameter="1.8"/>
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<pad name="5" x="3.81" y="-2.54" drill="1.0" diameter="1.8"/>
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<pad name="6" x="6.35" y="-2.54" drill="1.0" diameter="1.8"/>
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<!-- Silkscreen pin labels -->
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<text x="-6.35" y="-4.7" size="0.8" layer="21" align="center">SCK</text>
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<text x="-3.81" y="-4.7" size="0.8" layer="21" align="center">SD</text>
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<text x="-1.27" y="-4.7" size="0.8" layer="21" align="center">WS</text>
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<text x="1.27" y="-4.7" size="0.8" layer="21" align="center">L/R</text>
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<text x="3.81" y="-4.7" size="0.8" layer="21" align="center">GND</text>
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<text x="6.35" y="-4.7" size="0.8" layer="21" align="center">VDD</text>
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<!-- Part designator and value -->
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<text x="-7.5" y="5.6" size="1.0" layer="25">>NAME</text>
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<text x="-7.5" y="-6.6" size="0.8" layer="27">>VALUE</text>
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</package>
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</packages>
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<symbols>
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<symbol name="INMP441">
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<description>INMP441 I2S MEMS microphone (breakout module, 1 gate).</description>
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<!-- Symbol body -->
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<wire x1="-7.62" y1="10.16" x2="7.62" y2="10.16" width="0.254" layer="94"/>
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<wire x1="7.62" y1="10.16" x2="7.62" y2="-10.16" width="0.254" layer="94"/>
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<wire x1="7.62" y1="-10.16" x2="-7.62" y2="-10.16" width="0.254" layer="94"/>
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<wire x1="-7.62" y1="-10.16" x2="-7.62" y2="10.16" width="0.254" layer="94"/>
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<!-- Pins -->
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<pin name="SCK" x="-12.7" y="7.62" length="middle" direction="in"/>
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<pin name="SD" x="-12.7" y="2.54" length="middle" direction="out"/>
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<pin name="WS" x="-12.7" y="-2.54" length="middle" direction="in"/>
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<pin name="L/R" x="-12.7" y="-7.62" length="middle" direction="in"/>
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<pin name="GND" x="12.7" y="-7.62" length="middle" direction="pwr" rot="R180"/>
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<pin name="VDD" x="12.7" y="7.62" length="middle" direction="pwr" rot="R180"/>
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<!-- Label and value placeholders -->
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<text x="-7.62" y="10.8" size="1.778" layer="95">>NAME</text>
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<text x="-7.62" y="-12.7" size="1.778" layer="96">>VALUE</text>
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<!-- Part name inside the body -->
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<text x="0" y="0" size="1.4" layer="94" align="center">INMP441</text>
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<text x="0" y="-3" size="0.9" layer="94" align="center">I2S MEMS Mic</text>
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</symbol>
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</symbols>
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<devicesets>
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<deviceset name="INMP441_BREAKOUT" prefix="MIC">
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<description>INMP441 I2S MEMS microphone breakout module.
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Omnidirectional, 24-bit I2S output, 1.8-3.3 V supply.
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Footprint: 1x6 through-hole header, 2.54 mm pitch.</description>
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<gates>
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<gate name="G$1" symbol="INMP441" x="0" y="0"/>
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</gates>
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<devices>
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<device name="" package="INMP441_BREAKOUT_1X6">
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<connects>
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<connect gate="G$1" pin="SCK" pad="1"/>
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<connect gate="G$1" pin="SD" pad="2"/>
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<connect gate="G$1" pin="WS" pad="3"/>
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<connect gate="G$1" pin="L/R" pad="4"/>
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<connect gate="G$1" pin="GND" pad="5"/>
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<connect gate="G$1" pin="VDD" pad="6"/>
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</connects>
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<technologies>
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<technology name=""/>
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</technologies>
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</device>
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</devices>
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</deviceset>
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</devicesets>
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</library>
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</drawing>
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</eagle>
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